Impact of paperboard deformation and damage mechanisms on packaging performance

5° Seminar:

Research and innovation on materials & mechanics for paper, paperboard and paper products:

a series of seminars from worldwide experts

With material properties as a starting point, this presentation focuses on analyzing the performance of a paperboard package. Instead of focusing on simulating a specific load case as accurately as possible, the approach uses a basic material model based on measurable input parameters and FEM for varying design, geometry, and load case. The presentation explicitly addresses how moisture, creases, and bending stiffness affect packaging performance.

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